Like some of you, I have been highly anticipating the arrival of DDR3.  It's great when new products arrive because that makes the current hardware a little cheaper.  From the initial results I've seen of DDR3, it's not that great yet.  When DDR2 first came out, the same things were being said about it too.  People were complaining that the high latency of DDR2 would negate any gains from the high bus speed.  Well, we pretty much know that DDR3 is going to be good eventually, but for now I'm not too eager to go drop the wad of cash it would take to switch over.  Instead, I'm looking at the higher end DDR2 memory as the memory of choice for me.  Even though, DDR3 production is probably at the top of the priority list for manufacturers, some companies are still innovating when it comes to DDR2.  OCZ is trying to squeeze every bit of performance from those great micron chips and has started using watercooling in hopes of keeping those chips a little cooler.  This is the first company that I've seen to incorporate water blocks onto their memory modules and I'm anxious to try them out.

OCZ PC2-9200 Flex XLC Features

• 1150MHz DDR2  
• Memory Timings: 5-5-5-18

  Detailed Settings
  i965 Chipset	680i Chipset
  CAS 5	CAS 5
  TRDC 5	TRDC 5
  TRP 5	TRP 5
  TRAS 18	TRAS 18
  TWR 6	TRRD 6
  TRRC 42	TRC 33
  TRRD 11	TWR 6
  TRTR 11	TWTR 11
  TRTP 11	TREF 3.9
  TWTP 11

• Available in 2GB (2x1024) Dual Channel Kits 
• Unbuffered    
• OCZ Lifetime Warranty 
• 2.3 Volts 
• 240 Pin DIMM
• 2 x 1/4" ID (inner diameter) barbs
• FlexXLC Heatsink* 
• 8-Layer PCB**
• 2.35V EVP***
• EPP-Ready****

* The new OCZ FlexXLC (Xtreme Liquid Convention) heatsink delivers superior heat dissipation via the integrated hybrid copper and aluminum liquid injection system. The FlexXLC module was engineered with this unique “flexible” design to give enthusiasts the unparalleled option to run the modules passively or water cooled. The concurrent use of both technologies (water-cooling) promotes maximum heat dissipation and pushes thermal management of memory modules one step further to keep up with the ever-increasing frequency demands. FlexXLC modules seamlessly co-migrate with any system upgrade to liquid cooling.

**The PC2-9200 series is engineered with an 8-layer PCB with thermally conductive power and ground planes to guide heat away from the ICs and maintain the necessary signal integrity for high-end modules.

***OCZ EVP (Extended Voltage Protection) is a feature that allows performance enthusiasts to use a VDIMM of 2.35V without invalidating their OCZ Lifetime Warranty.

****EPP (Enhanced Performance Profiles) setting is rated at 1142MHz

OCZ's Description

     As the World’s fastest DDR2, the PC2-9200, in combination with the innovative FlexXLC technology, is considerably the most ground-breaking and unique memory product existing today.

     These new modules feature the new OCZ FlexXLC (Xtreme Liquid Convention) heatsink that delivers superior heat dissipation via a hybrid copper and aluminum design alterable between passive air or water cooling.

     Among these thermal management advantages, the PC2-9200 FlexXLC also implements a new 8-layer PCB. This facilitates less “crosstalk,” consequently enhancing the module’s total signal integrity.

     The PC2-9200 FlexXLC modules are optimized for the latest cutting edge platforms and will be available in 2GB (2x1024MB) dual channel kits. As part of OCZ’s line-up of premium memory, the PC2-9200 series is backed by a Lifetime Warranty and industry-leading technical support. Harnessing the achievement of leading-edge speed, high performance heat dissipation, and enhanced signal integrity, the unparalleled design of the OCZ PC2-9200 FlexXLC is a complete, all-encompassing solution certain to set a new benchmark in enthusiast memory.

     From what I'm told the PC2-9200 is using Micron chips.  This should make for some pretty good performance and maybe even a little overclocking.